• Home
  • »
  • ASUS PRIME Z790-P-CSM ATX Motherboard – DDR5

ASUS PRIME Z790-P-CSM ATX Motherboard – DDR5

275.97 USD

Item Condition : New

  • 0 available

Intel® 13th & 12th Gen Processors (LGA 1700) 4 x DIMM slots, Max. 192GB, DDR5 RAM 3 x M.2 slots and 4x SATA 6Gb/s ports*

  • Sold by pcstore See other items
  • SKUsku_19_5958
  • ShippingOODDSS Economy Delivery 1KD,
  • Delivery Varies for items shipped from an international location
    Delivery within 4 business days
  • CountryKuwait
  • Return0 days

Details

ASUS Prime series motherboards are expertly engineered to unleash the full potential of 13th Gen Intel® Core™ Processors. Boasting a robust power design, comprehensive cooling solutions and intelligent tuning options, PRIME Z790-P-CSM provides users and PC DIY builders with a range of performance optimizations via intuitive software and firmware features.

ASUS Corporate Stable Model

ASUS Corporate Stable Model (CSM) is a commercial program designed to provide stable and reliable motherboards. Offering up to 36-month product lifecycle support and 6-month end-of-life notice to allow sufficient lead times for your organization to get ready for product transitions. Each purchase of an ASUS CSM motherboard comes with ASUS Control Center Express – server-grade IT management software.

* Lifecycle support, program offering and supply status may vary by region. Please consult your local sales representative for more information.

COOLING

PRIME Z790-P-CSM motherboard is engineered with multiple onboard heatsinks and an array of hybrid fan headers to ensure your rig stays cool and stable under intense workloads.

M.2 Heatsink

The flexible M.2 heatsink with removable captive screws can take care of the M.2_1 or M.2_3 slot, warding off throttling that can occur with M.2 storage during sustained transfers.

VRM Heatsinks and Thermal Pads

The extensive surface area of the massive heatsinks cover the VRMs and chokes to improve heat dissipation. Together with specially engineered thermal pads, they improve heat transfer from the MOSFETs and chokes for better cooling performance.